HT1621    RAM Mapping 32x4 LCD Controller for I/O MCU

Revision # 2.21   Modifications made on September 25, 2008

  • A Patent Notice has been added to the datasheet.

Revision # 2.20   Modifications made on July 24, 2008

  • At the Pin Assignment section, the caption 44 QFP-A was modified to 44 QFP-B package.

Revision # 2.10   Modifications made on June 10, 2008

  • The D.C. Characteristics table was modified.

Revision # 2.00   Modifications made on April 17, 2008

  • In the Pin Assignment section, the 44-pin QFP package was modified.

Revision # 1.90   Modifications made on January 30, 2008

  • In the Features and other related sections a new 44-pin QFP package was added.
  • The Pad Assignment section was modified.
  • The Pad Coordinates section was modified.

Revision # 1.80   Modifications made on December 6, 2007

  • The A.C. Characteristics section was modified.

Revision # 1.70   Modifications made on June 29, 2005

  • HT1621 48-pin SSOP package and HT1621B 48-pin DIP package were deleted from the Features, Pin Assignment and other related sections.

Revision # 1.60   Modifications made on November 26, 2004

  • At the A.C. Characteristics table, the following changes were made:
    • A 4kHz each for the 3V and 5V Min. values for fCLK1 were added.
    • A 125µs each for the 3V and 5V, Write mode Max. values for tCLK were added.

Revision # 1.50   Modifications made on October 13, 2004

  • At the D.C. Characteristics table, the 3V Min., Typ. and Max. values for RPH were changed from 40kW, 80kW, 150kW to 60kW, 120kW, 200kW respectively.

Revision # 1.40   Modifications made on May 4, 2004

  • At the Absolute Maximum Ratings section, the Operating Temperature range was modified from (-25°C to 75°C) to (-40°C to 85°C).
  • At the Functional Description section, Crystal Selection section was added.
  • At the Application Circuits section, the Host controller diagram was modified by adding C1 and C2 capacitors which were connected to the ground. Then more text contents were added to the note, including a table for Crystal Error and Capacity Value.

Revision # 1.30   Modifications made on August 6, 2003

  • At the Features section, HT1621B 48-pin LQFP package and HT1621G for Gold bumped chip package were added.
  • At the Pin Assignment section, HT1621B 48-pin LQFP package was added.
  • At the Pad Assignment section, Bump height, spacing and size were added.
  • Package Information section was added.
  • Product Tape and Reel Specifications section was added.

Revision # 1.20   Modifications made on January 10, 2001

  • Two columns for HT1627 and HT16270 were deleted from the Selection Table.

Revision # 1.10   This was posted on May 4, 2000

  • Some items and/or labels on the Application Circuits were updated.

 
 

Product Description